Endoscopic Inspection of Solder Joint Integrity in Chip Scale Packages
نویسنده
چکیده
This paper reports, for the first time, the use of endoscopy for the nondestructive examination of solder joint integrity in chip scale packages (CSP) such as flip chip on flex (FCF). Borrowed from the medical instrument technology, the endoscope is used to examine visually the inside of an organ. This concept has now been developed and refined by ERSA and KURTZ, and led to an ERSASCOPE inspection system coupled with sophisticated but user-friendly software for data and image analysis. We have successfully used this endoscopic method to evaluate the solder joint integrity in CSP such as cold joints, standoff height measurements, and probing of inner rows of ball joint integrity. Since this new instrument has only been introduced very recently, we will also report the latest results for obtaining the optimal examination of solder joint integrity achievable in conjunction with ERSA and KURTZ. By analyzing the many varieties of CSP samples from our EPA Centers clients, we have witnessed the tremendous power of endoscopy when applied to the nondestructive examination of CSPs solder joints, and found this method of immense use to the quality assessment of miniaturized electronic packages. We will also give a critical review of this inspection method when applied to CSP.
منابع مشابه
An Overview of Solder Bump Shape Prediction Algorithms with Validations
The trend to reduce the size of electronic packages and develop increasingly sophisticated electronic devices with more, higher density inputs/outputs (I/Os), leads to the use of area array packages using chip scale packaging (CSP), flip chip (FC), and wafer level packaging (WLP) technologies. Greater attention has been paid to the reliability of solder joints and the assembly yield of the surf...
متن کاملSolder joint fatigue models : review and applicability to chip scale packages
A review of fourteen solder joint fatigue models is presented here with an emphasis on summarizing the features and applications of each fatigue model. The models are classi®ed into ®ve categories: stress-based, plastic strainbased, creep strain-based, energy-based, and damage-based. Fatigue models falling outside these categories are categorized as `other empirical models'. Each model is prese...
متن کاملDefect Inspection of Flip Chip Solder Bumps Using an Ultrasonic Transducer
Surface mount technology has spurred a rapid decrease in the size of electronic packages, where solder bump inspection of surface mount packages is crucial in the electronics manufacturing industry. In this study we demonstrate the feasibility of using a 230 MHz ultrasonic transducer for nondestructive flip chip testing. The reflected time domain signal was captured when the transducer scanning...
متن کاملReliability Analyses for New Improved High Performance Flip Chip BGA Packages
High pin count and superior thermal dissipation are the main driving factors for high performance IC packages. Flip chip interconnects technology can generally achieve I/O count of more than 500, and large amount of heat in the silicon chip can be dissipated efficiently through metal heat spreader attachment. A one-piece cavity lid flip chip BGA package with high pin count and targeted reliabil...
متن کاملModeling of Solder Joint Defects through a Level-set Approach
Due to the inherent nature of flip-chip assembly, the solder joints lie beneath the device and therefore are not amenable to visual inspection. Hence, it is important at the design stage to ensure that solder defects such as joint separation or joint shortening do not occur in the assembly. As a first step, the solder joint is modeled using a level-set approach. Unlike conventional fronttrackin...
متن کامل